OVERVIEW
A leading developer of radiation detection solutions based on high-performance sensor materials; their requirement was for us to develop a new chip to interrogate specialist sensor technology.
The customer decided on an ASIC development to help improve signal integrity, power consumption, size and cost of the detector. The project formed part of a government funded initiative with limited funding and tight timescales.
INPUT
After conducting a feasibility study we delivered a product specification and Statement of Work – this included provision for chip design, package development and supply, as well as full production test development. We introduced the client to a preferred partner for silicon manufacture, who could also complete assembly and production test elements of the build.
Tape-out was achieved within six months of design start, and within twelve months the customer had tested working samples of the final chip on their own customer’s premises.
In parallel to the design process, we managed the test programme and customisation for the relatively large package.
OUTCOME
We provided a fully managed development process – from concept to final silicon. Our ability to provide a turnkey solution and supply chain management offered our client a range of possible routes to a completed product.
There was no compromise on quality, despite a tight project timescale. All budget targets were met and the product worked in the application first time. The client has a defined production flow for volume requirements and is now able to proceed to development of the next generation of sensor interface.
